Display panel and a method of fabricating the same

ABSTRACT

A display panel including: a base substrate including first and second surfaces, a display region and a peripheral region; a pixel layer provided on the display region, the pixel layer including a plurality of pixels; a module hole penetrating the display region; a blocking groove in the display region and adjacent to the module hole, the blocking groove being recessed in the base substrate; an encapsulation layer provided on the pixel layer, the encapsulation layer including a first inorganic layer, a second inorganic layer and an organic layer; and a filling member in the blocking groove, the filling member including a same material as the organic layer, wherein the second inorganic layer covers a top surface of the filling member and a top surface of the first inorganic layer adjacent to the top surface of the filling member.

CROSS-REFERENCE TO RELATED APPLICATIONS

This U.S. non-provisional is a continuation of U.S. patent applicationSer. No. 17/583,493 filed on Jan. 25, 2022, which is a continuation ofU.S. patent application Ser. No. 16/385,659 filed on Apr. 16, 2019, now.U.S. Pat. No. 11,233,220 issued on Jan. 25, 2022, which claims priorityunder 35 U.S.C. § 119 to Korean Patent Application No. 10-2018-0049886,filed on Apr. 30, 2018, in the Korean Intellectual Property Office, thedisclosures of which are incorporated by reference herein in theirentireties.

TECHNICAL FIELD

The present inventive concept relates to a display panel and a method offabricating the same, and in particular, to a highly reliable displaypanel and a method of fabricating the same.

DISCUSSION OF RELATED ART

A display panel is an electronic device used to display an image. Anorganic light emitting display panel is an example of a display paneland has certain characteristics, such as low power consumption, highbrightness, and high response speed.

The organic light emitting display panel includes an organic lightemitting device, which may be damaged by oxygen or moisture. If theorganic light emitting display panel is configured to effectively blockthe oxygen or moisture, the reliability and lifespan of the organiclight emitting display panel can be increased.

SUMMARY

According to an exemplary embodiment of the inventive concept, a displaypanel may include a base substrate including a first surface and asecond surface and including a display region and a peripheral region,which are adjacent to each other when viewed in a plan view, a pixellayer including a plurality of pixels provided on the display region, amodule hole penetrating the display region of the base substrate fromthe first surface to the second surface, a blocking groove provided inthe display region of the base substrate and adjacent to the modulehole, the blocking groove being recessed in the base substrate, anencapsulation layer provided on the pixel layer, the encapsulation layerincluding a first inorganic layer, a second inorganic layer on the firstinorganic layer, and an organic layer between the first inorganic layerand the second inorganic layer, and a filling member provided in theblocking groove, the filling member including a same material as theorganic layer. The second inorganic layer may cover a top surface of thefilling member and a top surface of the first inorganic layer adjacentto the top surface of the filling member.

In an exemplary embodiment of the inventive concept, the base substratemay include a first base layer and a first barrier layer. The first baselayer may include an organic material and may include a first patternedportion, which is recessed beneath a top surface of the first baselayer. The first barrier layer may be provided on the top surface of thefirst base layer to define the first surface of base substrate. Thefirst barrier layer may include an inorganic material and may include afirst opening, which is connected to the first patterned portion todefine an internal space. The blocking groove may be provided in theinternal space, and the first inorganic layer may cover the internalspace and define an inner surface of the blocking groove.

In an exemplary embodiment of the inventive concept, a width of thefirst opening may be smaller than a width of the first patternedportion.

In an exemplary embodiment of the inventive concept, the base substratemay further include a second base layer provided below the first baselayer and defining the second surface of the base substrate, a secondbarrier layer provided between the second base layer and the first baselayer. The second base layer may contain an organic material, and thesecond barrier layer may contain an inorganic material. The firstpatterned portion may penetrate the first base layer and expose aportion of the second barrier layer.

In an exemplary embodiment of the inventive concept, the base substratemay further include a second patterned portion overlapped with the firstopening, when viewed in a plan view, and a second opening provided inthe second barrier layer. The second patterned portion may be recessedbeneath a top surface of the second base layer, and the second openingmay be connected to the second patterned portion to define a spacewithin the second base layer. The second opening and the secondpatterned portion may be covered with the first inorganic layer.

In an exemplary embodiment of the inventive concept, the display panelmay further include a charge control layer provided between the firstbarrier layer and the first inorganic layer. The charge control layermay include a first end portion adjacent to the blocking groove and asecond end portion adjacent to the module hole. The first end portionmay be covered with the first inorganic layer, and the second endportion may be exposed to define an inner surface of the module hole.

In an exemplary embodiment of the inventive concept, the display panelmay further include a partition wall member provided on the basesubstrate and adjacent to the organic layer. The first inorganic layerand the second inorganic layer may cover the partition wall member. Inan exemplary embodiment of the inventive concept, the blocking groovemay include first and second blocking grooves, when viewed in a planview. The first and second blocking grooves may be spaced apart fromeach other, in a region overlapped by the organic layer and adjacent tothe module hole when viewed in a plan view, the partition wall member isprovided on regions between the first and second blocking groove sandthe organic layer, between the blocking grooves and the module hole, andbetween the blocking grooves.

According to an exemplary embodiment of the inventive concept, anelectronic device may include a base substrate including a first baselayer containing an organic material and a first barrier layercontaining an inorganic material and covering a top surface of the firstbase layer, the base substrate including a display region and aperipheral region, which are adjacent to each other when viewed in aplan view, a pixel layer including a plurality of pixels provided on thedisplay region, an encapsulation layer including a first inorganic layeron the pixel layer, a second inorganic layer on the first inorganiclayer, and an organic layer between the first and second inorganiclayers, a module hole penetrating the display region of the basesubstrate, a blocking groove provided in the display region of the basesubstrate and covered by the first inorganic layer, a filling memberincluding a same material as the organic layer and filling the blockinggroove, and an electronic module overlapped with the module hole. Theblocking groove may include an opening, which penetrates the firstbarrier layer, and a patterned portion, which is overlapped with theopening when viewed in a plan view and is recessed below the top surfaceof the first base layer.

In an exemplary embodiment of the inventive concept, the secondinorganic layer may be in contact with a top surface of the fillingmember exposed by the opening and a top surface of the first inorganiclayer adjacent to the top surface of the filling member.

In an exemplary embodiment of the inventive concept, the blocking groovemay have a closed curve shape enclosing the module hole, when viewed ina plan view.

In an exemplary embodiment of the inventive concept, when viewed in aplan view, a shape of the module hole may be different from the closedcurve shape of the blocking groove.

In an exemplary embodiment of the inventive concept, the electronicdevice may further include a touch sensor, which is provided on theencapsulation layer, and a third inorganic layer, which covers the touchsensor. The third inorganic layer may cover the second inorganic layer.

In an exemplary embodiment of the inventive concept, the first barrierlayer includes first and second tip portions overlapping the blockinggroove, the first and second tip portions may be in contact with thefilling member and may be supported by the filling member.

In an exemplary embodiment of the inventive concept, a width of thefilling member between the first and second tip portions is less than awidth of the filling member between the first base layer in the blockinggroove.

According to an exemplary embodiment of the inventive concept, a methodof fabricating a display panel may include forming a pixel layerincluding a plurality of pixels on a display region of a base substrate,wherein the base substrate includes a peripheral region adjacent to thedisplay region, the display region including a hole region and ablocking region enclosing the hole region, when viewed in a plan view,removing a portion of the base substrate overlapped with the blockingregion to form a blocking groove, depositing a first inorganic layer onthe base substrate to cover the pixel layer and an inner surface of theblocking groove, depositing an organic material on the first inorganiclayer to form a preliminary organic layer filling the blocking grooveand covering the pixel layer, removing the preliminary organic layerfrom a portion of each of the display and blocking regions to form anorganic layer and a filling member, forming a second inorganic layer tocover the organic layer and the filling member, and forming a modulehole to penetrate a portion of the base substrate enclosed by theblocking groove.

In an exemplary embodiment of the inventive concept, the module hole maybe formed to penetrate the base substrate, the first inorganic layer,and the second inorganic layer and to have a side surface defined by anexposed end of each of the base substrate, the first inorganic layer,and the second inorganic layer.

In an exemplary embodiment of the inventive concept, the forming of thepixel layer may include forming an organic light emitting layer and acommon layer. A portion of an organic material constituting the commonlayer may be used as an organic pattern covering a portion of theblocking groove, and the first inorganic layer may be formed to coverthe organic pattern.

In an exemplary embodiment of the inventive concept, the method mayfurther include forming a partition wall member between the pixel layerand the blocking groove. The forming of the pixel layer may includeforming a thin-film device layer between a plurality of insulatinglayers and forming a display device layer coupled to the thin-filmdevice layer. The partition wall member may be formed by a same processas that used to form the plurality of insulating layers.

In an exemplary embodiment of the inventive concept, the preliminaryorganic layer may include a first preliminary organic layer provided onthe pixel layer and a second preliminary organic layer provided on theblocking groove. The forming of the organic layer and the filling membermay include removing a portion of the second preliminary organic layerto expose the first inorganic layer on the blocking region.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments of the inventive concept will be more clearlyunderstood from the following detailed description taken in conjunctionwith the accompanying drawings.

FIG. 1 is a perspective view illustrating an electronic display deviceaccording to an exemplary embodiment of the inventive concept.

FIG. 2 is an exploded perspective view of the electronic device of FIG.1 .

FIG. 3 is a block diagram of the electronic device of FIG. 1 .

FIG. 4A is a sectional view taken along line I-I′ of FIG. 2 .

FIG. 4B is a sectional view illustrating an electronic device, in whicha touch sensing unit, in addition to elements of FIG. 4A, is provided.

FIGS. 5A and 5B are sectional views each illustrating a hole region ofFIG. 4A.

FIGS. 6A, 6B, 6C, 6D and 6E are sectional views each illustrating aportion of a display panel according to an exemplary embodiment of theinventive concept.

FIG. 7 is a sectional view illustrating a portion of a display panelaccording to an exemplary embodiment of the inventive concept.

FIGS. 8A, 8B and 8C are plan views each illustrating a hole regionaccording to an exemplary embodiment of the inventive concept.

FIGS. 9A, 9B and 9C are sectional views each illustrating a displaypanel according to an exemplary embodiment of the inventive concept.

FIGS. 10A, 10B, 10C, 10D, 10E, 10F and 10G are sectional viewsillustrating a method of fabricating a display panel, according to anexemplary embodiment of the inventive concept.

FIGS. 11A, 11B, 11C, 11D and 11E are sectional views illustrating amethod of fabricating a display panel including a partition wall member,according to an exemplary embodiment of the inventive concept.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Exemplary embodiments of the inventive concept will now be describedmore fully with reference to the accompanying drawings. Exemplaryembodiments of the inventive concept may, however, be embodied in manydifferent forms and should not be construed as being limited to theembodiments set forth herein. In the drawings, the thicknesses of layersand regions may be exaggerated for clarity. Like reference numerals inthe drawings may denote like elements, and thus, their description maybe omitted.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent.

As used herein, the singular forms “a,” “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

FIG. 1 is a perspective view illustrating an electronic display deviceaccording to an exemplary embodiment of the inventive concept. FIG. 2 isan exploded perspective view of the electronic device of FIG. 1 . FIG. 3is a block diagram of the electronic device of FIG. 1 . Hereinafter, anelectronic device according to an exemplary embodiment of the inventiveconcept will be described in more detail with reference to FIGS. 1 to 3.

As shown in FIGS. 1 to 3 , an electronic device EA may include a frontsurface, which is used to display an image IM and serves as a displaysurface. The display surface may be parallel to a first direction DR1and a second direction DR2. The display surface may include atransmission region TA and a bezel region BZA adjacent to thetransmission region TA.

The transmission region TA of the electronic device EA may be used todisplay the image IM. In FIG. 1 , an internet search window isillustrated as an example of the image IM. The transmission region TAmay have a tetragonal or rectangular shape whose sides are parallel tothe first direction DR1 and the second direction DR2. However, theinventive concept is not limited to this example, and in an exemplaryembodiment of the inventive concept, a shape of a display region DA maybe variously changed.

The bezel region BZA may be adjacent to the transmission region TA. Thebezel region BZA may enclose the transmission region TA. However, theinventive concept is not limited to this example, and in an exemplaryembodiment of the inventive concept, the bezel region BZA may beprovided on one side of the transmission region TA or may be omitted.Furthermore, the inventive concept is not limited to a particularstructure of the electronic device EA. For example, the electronicdevice EA may be provided in various forms.

Hereinafter, a direction that is normal to the display surface will bereferred to as a thickness direction of the electronic device EA or athird direction DR3. In the present embodiment, a front or top surfaceand a rear or bottom surface of each element may be distinguished fromeach other, with respect to the third direction DR3 or a displaydirection of the image IM. For example, the front and rear surfaces maybe two opposite surfaces facing each other in the third direction DR3.

In the present specification, directions indicated by the first to thirddirections DR1, DR2, and DR3 may be used to indicate other directions.Hereinafter, first to third directions may be directions indicated bythe first to third directions DR1, DR2, and DR3, respectively, and willbe referenced with the same numerals.

The electronic device EA may include a display panel DP, a window memberWD, an electronic module ID, and a housing member HS. In an exemplaryembodiment of the inventive concept, as shown in FIG. 3 , the electronicdevice EA may further include a display module DD, a first electronicmodule EM1, a second electronic module EM2, and a power supply modulePM. For convenience in illustration, some of elements illustrated inFIG. 3 are omitted from FIG. 2 .

The display module DD may include a display panel DP and a touch sensingunit TSU. The display panel DP may be configured to generate the imageIM. The touch sensing unit TSU may be configured to sense a user inputprovided from the outside. The user input may include various types ofexternal inputs, such as a part of a user's body, light, heat, orpressure. In an exemplary embodiment of the inventive concept, the touchsensing unit TSU may be directly provided on the display panel DP. Forexample, the touch sensing unit TSU may be directly disposed on thedisplay panel DP. To reduce complexity in the drawings, the touchsensing unit TSU may not be illustrated in FIG. 2 .

The display panel DP may include a hole region PA, a display region DA,and a peripheral region NDA. As described above, the display region DAmay be used to generate and display the image IM. For example, aplurality of pixels, which are used to generate light for the image IM,may be provided in the display region DA. This will be described in moredetail below. The peripheral region NDA may be adjacent to the displayregion DA. The peripheral region NDA may enclose the display region DA.A driving circuit or a line driver for driving the display region DA maybe provided in the peripheral region NDA.

A portion of the peripheral region NDA of the display panel DP may becurved or bent. For example, a portion of the peripheral region NDA mayface the front surface of the electronic device EA, and another portionof the peripheral region NDA may face a rear surface of the electronicdevice EA. In an exemplary embodiment of the inventive concept, theperipheral region NDA may be omitted from the display panel DP.

The hole region PA may be enclosed by the display region DA. When viewedin a sectional view, a blocking groove BR, a module hole MH, and afilling member FM may be formed or provided in the hole region PA. In anexemplary embodiment of the inventive concept, the blocking groove BR,the module hole MH, and the filling member FM may be formed within thedisplay region DA, which is a region for displaying an image.

The blocking groove BR may adjacent to the module hole MH. For example,the blocking groove BR may enclose the module hole MH. The module holeMH may penetrate the display panel DP. The module hole MH of FIG. 2 maybe shaped like a circular cylinder extending in the third direction DR3.The module hole MH may be overlapped with an electronic module ID, whenviewed in a plan view. The electronic module ID may be inserted into themodule hole MH. In addition, the electronic module ID may be disposed ona rear surface of a base substrate 10 adjacent to the module hole MH,and only a part of the electronic module ID may be exposed to theoutside through the module hole MH. For example, only a lensconstituting a camera module CMM may be exposed to the outside throughthe module hole MH.

In an exemplary embodiment of the inventive concept, since the displaypanel DP includes the module hole MH formed in the display region DA,there is no need to provide an additional space for the electronicmodule ID in a region outside the display region DA. Thus, it ispossible to reduce an area for the peripheral region NDA and to producethe electronic device EA with a narrow bezel. Furthermore, when theelectronic module ID is provided within the module hole MH, it ispossible to reduce a thickness of the electronic device EA. The blockinggroove BR and the module hole MH will be described in more detail below.

The window member WD may be provided on the front surface of theelectronic device EA. The window member WD may be provided on the frontsurface of the display panel DP and may be used to protect the displaypanel DP. For example, the window member WD may include a glasssubstrate, a sapphire substrate, or a plastic film. The window member WDmay have a single- or multi-layered structure. For example, the windowmember WD may have a stacking structure including a plurality of plasticfilms, which are coupled to each other by an adhesive layer, or may havea stacking structure including a glass substrate and a plastic film,which are coupled to each other by an adhesive layer.

The window member WD may include the transmission region TA and thebezel region BZA. The transmission region TA may be a region of thewindow member WD corresponding to the display region DA. For example,the transmission region TA may be overlapped with the entire region orat least a region of the display region DA. The image IM displayed onthe display region DA of the display panel DP may be provided to anexternal user through the transmission region TA.

A shape of the bezel region BZA may correspond to a shape of thetransmission region TA. The bezel region BZA may be adjacent to thetransmission region TA to enclose the transmission region TA. The bezelregion BZA may have a predetermined color. The bezel region BZA maycover the peripheral region NDA of the display panel DP and prevent theperipheral region NDA from being recognized by a user. However, theinventive concept is not limited to the above example, and in anexemplary embodiment of the inventive concept, the bezel region BZA maybe omitted from the window member WD.

The housing member HS may be coupled with the window member WD. Thehousing member HS may be the rear surface of the electronic device EA.The housing member HS may be coupled to the window member WD to form aninternal space. The display panel DP, the electronic module ID, andseveral elements illustrated in FIG. 3 may be contained in the internalspace. The housing member HS may include a material having a relativelyhigh strength. For example, the housing member HS may include aplurality of frames and/or plates, each of which is formed of at leastone of glass, plastic, or metallic materials. The housing member HS maybe used to stably protect the elements of the electronic device EA,which are contained in the internal space, from an external impact.

The power supply module PM may be configured to supply an electric powerto the electronic device EA. The power supply module PM may include abattery module.

The electronic module ID may include various functional modules, whichare used to operate the electronic device EA. The electronic module IDmay include the first electronic module EM1 and the second electronicmodule EM2.

The first electronic module EM1 may be directly mounted on amotherboard, which is electrically connected to the display module DD.Alternatively, the first electronic module EM1 may be mounted on anothersubstrate and may be electrically connected to the motherboard through aconnector.

The first electronic module EM1 may include a control module CM, awireless communication module TM, an image input module IS, a soundinput module AIM, a memory MM, and an outer interface EF. At least oneof these modules may not be mounted on the motherboard and may beelectrically connected to the motherboard through a flexible circuitboard.

The control module CM may be configured to control overall operations ofthe electronic device EA. The control module CM may be, for example, amicroprocessor. In an exemplary embodiment of the inventive concept, thedisplay module DD may be activated or inactivated under the control ofthe control module CM. The control module CM may control other modules,such as the image input module IS or the sound input module AIM, basedon touch signals received from the display module DD.

The wireless communication module TM may be configured to transmit andreceive a wireless signal to and from another terminal via a Bluetoothor a Wi-Fi line. The wireless communication module TM may be configuredto transmit and receive a voice signal via a communication line. Thewireless communication module TM may include a transmitter TM1, which isconfigured to modulate and transmit a signal to be transmitted, and areceiver TM2, which is configured to demodulate a received signal.

The image input module IS may be configured to process an image signaland to convert the image signal into image data that can be displayed onthe display module DD. The sound input module AIM may be configured toreceive an external sound signal through a microphone in a recordingmode or in a voice recognition mode and then to convert the sound signalinto electrical voice data.

The outer interface EF may be configured to serve as an interface thatis connected to an external charger, a wired/wireless data port, a cardsocket (e.g., a memory card or a subscriber identity module (SIM)/useridentity module (UIM) card), and so forth.

The second electronic module EM2 may include a sound output module AOM,a light-emitting module LM, a light-receiving module LRM, and a cameramodule CMM. The modules of the second electronic module EM2 may bedirectly mounted on a motherboard. Alternatively, the modules of thesecond electronic module EM2 may be mounted on another substrate and maybe electrically connected to the display module DD or the firstelectronic module EM1 through a connector.

The sound output module AOM may be configured to convert sound data,which are transmitted from the wireless communication module TM or arestored in the memory MM, and to output the converted sound data to theoutside.

The light-emitting module LM may be configured to generate and emitlight. In an exemplary embodiment of the inventive concept, thelight-emitting module LM may be configured to emit infrared light. Thelight-emitting module LM may include a light emitting diode (LED)device. The light-receiving module LRM may be configured to senseinfrared light. The light-receiving module LRM may be activated, when aninfrared light incident thereto has an intensity higher than a referencevalue. The light-receiving module LRM may include a complementary metaloxide semiconductor (CMOS) sensor. The infrared light emitted from thelight-emitting module LM may be reflected by an external object (e.g., auser's finger or face) and may be incident into the light-receivingmodule LRM. The camera module CMM may be used to obtain an image of anexternal object.

The electronic module ID of FIG. 2 may be one of the elementsconstituting the second electronic module EM2. Here, the firstelectronic module EM1 and the remaining elements of the secondelectronic module EM2 may be placed at other positions. However, theinventive concept is not limited to this example, and in an exemplaryembodiment of the inventive concept, the electronic module ID may be atleast one of the modules constituting the first and second electronicmodules EM1 and EM2.

FIG. 4A is a sectional view taken along line I-I′ of FIG. 2 . FIG. 4B isa sectional view illustrating an electronic device, in which a touchsensor, in addition to elements of FIG. 4A, is provided. Hereinafter, anelectronic device according to an exemplary embodiment of the inventiveconcept will be described with reference to FIGS. 4A and 4B.

As shown in FIG. 4A, the display panel DP may include a base substrate10, a thin-film device layer 20, and a display device layer 30. The basesubstrate 10, the thin-film device layer 20, and the display devicelayer 30 may be stacked in the third direction DR3. In an exemplaryembodiment of the inventive concept, the thin-film device layer 20 andthe display device layer 30 may constitute a pixel layer PL.

The base substrate 10 may include a first barrier layer 11, a first baselayer 12, a second barrier layer 13, and a second base layer 14.

A top surface of the first barrier layer 11 may be used as a frontsurface of the base substrate 10. The first barrier layer 11 may be aninsulating layer containing an inorganic material. For example, thefirst barrier layer 11 may be formed of or include silicon oxide,silicon nitride, or amorphous silicon.

The first base layer 12 may be provided below the first barrier layer11. The first base layer 12 may be an insulating layer containing anorganic material. The first base layer 12 may include a flexible plasticmaterial. For example, the first base layer 12 may be formed of orinclude polyimide (PI), polyethylene naphthalate (PEN), polyethyleneterephthalate (PET), polyarylate, polycarbonate (PC), polyetherimide(PEI), or polyethersulfone (PES).

The second barrier layer 13 may be provided below the first base layer12. The second barrier layer 13 may be formed of or include the samematerial as the first barrier layer 11.

The second base layer 14 may be provided below the second barrier layer13. The first and second base layers 12 and 14 and the first and secondbarrier layers 11 and 13 may be alternatingly provided in the thirddirection DR3. The second base layer 14 may be formed of or include thesame material as the first base layer 12. However, the inventive conceptis not limited to this example, and in an exemplary embodiment of theinventive concept, the second barrier layer 13 and the second base layer14 may be omitted from the display panel DP.

In an exemplary embodiment of the inventive concept, the base substrate10 may further include a buffer layer. The buffer layer may be providedon the first barrier layer 11. The buffer layer may be formed of orinclude an inorganic or organic material. The buffer layer may be higherthan the first barrier layer 11 in terms of an adhesion strength to asemiconductor pattern SL or a first insulating layer 21 to be describedbelow. Accordingly, it is possible to more stably form the thin-filmdevice layer 20 on the base substrate 10.

The thin-film device layer 20 may include a plurality of insulatinglayers and a thin-film transistor TR. The thin-film device layer 20 maybe provided on the base substrate 10. Each of the insulating layers maybe formed of or include inorganic or organic materials. The insulatinglayers may include first, second and third insulating layers 21, 22, and23.

The thin-film transistor TR may include a semiconductor pattern SL, acontrol electrode CE, an input electrode IE, and an output electrode OE.The thin-film transistor TR may be configured to control current theflow of electric charges passing through the semiconductor pattern SL,based on signals applied to the control electrode CE, or to selectivelyoutput electrical signals, which are input from the input electrode IE,through the output electrode OE.

The semiconductor pattern SL may be provided on the base substrate 10.The semiconductor pattern SL may be formed of or include a crystallinesemiconductor material or an amorphous silicon.

The first insulating layer 21 may be provided between the semiconductorpattern SL and the control electrode CE. In the present embodiment, thefirst insulating layer 21 is provided on the front surface of the firstbarrier layer 11 and covers the semiconductor pattern SL, but in anexemplary embodiment of the inventive concept, the first insulatinglayer 21 may expose the hole region PA.

The control electrode CE may be provided on the semiconductor patternSL, as shown in FIGS. 4A and 4B. However, the inventive concept is notlimited to this example, and in an exemplary embodiment of the inventiveconcept, the thin-film transistor TR may be configured to include thecontrol electrode CE and the semiconductor pattern SL on the controlelectrode CE.

The second insulating layer 22 may be provided between the controlelectrode CE and the input electrode IE and between the controlelectrode CE and the output electrode OE. The input and outputelectrodes IE and OE may be provided on the second insulating layer 22.The input electrode IE and the output electrode OE may penetrate thefirst and second insulating layers 21 and 22 and may be coupled to twoopposite portions of the semiconductor pattern SL, respectively.However, the inventive concept is not limited to these examples, and inan exemplary embodiment of the inventive concept, the input and outputelectrodes IE and OE may be directly coupled to the semiconductorpattern SL.

The third insulating layer 23 may be provided on the second insulatinglayer 22. The third insulating layer 23 may cover the thin-filmtransistor TR. The third insulating layer 23 may be used to electricallydisconnect the thin-film transistor TR from the display device layer 30.

The display device layer 30 may include an organic light emitting deviceED and a plurality of insulating layers. The insulating layers of thedisplay device layer 30 may include a fourth insulating layer 31 and anencapsulation layer TE.

The fourth insulating layer 31 may be provided on the third insulatinglayer 23. A plurality of openings may be formed in the fourth insulatinglayer 31. The organic light emitting device ED may be provided in eachof the openings.

The organic light emitting device ED may include a first electrode E1, asecond electrode E2, a light emitting layer EL, and a charge controllayer OL. The first electrode E1 may be provided on the thin-film devicelayer 20. The first electrode E1 may penetrate the third insulatinglayer 23 and may be electrically coupled to the thin-film transistor TR.In an exemplary embodiment of the inventive concept, a plurality of thefirst electrodes E1 may be provided. At least a portion of each of thefirst electrodes E1 may be exposed by a corresponding one of theopenings in the fourth insulating layer 31.

The second electrode E2 may be provided on the first electrode E1. In anexemplary embodiment of the inventive concept, the second electrode E2may be a single pattern, which is overlapped with a plurality of thefirst electrodes E1 and the fourth insulating layer 31. In the casewhere a plurality of the organic light emitting devices ED are provided,the second electrode E2 may be used to apply the same voltage to theplurality of the organic light emitting devices ED. In this case, thesecond electrode E2 may be formed without an additional patterningprocess. However, the inventive concept is not limited to this example,and in an exemplary embodiment of the inventive concept, a plurality ofthe second electrodes E2 may be provided to correspond to the openingsin the fourth insulating layer 31, respectively.

The light emitting layer EL may be provided between the first electrodeE1 and the second electrode E2. In an exemplary embodiment of theinventive concept, a plurality of the light emitting layers EL may beprovided in the openings in the fourth insulating layer 31,respectively. In the organic light emitting device ED, a potentialdifference between the first and second electrodes E1 and E2 may beadjusted to selectively activate the light emitting layer EL or to allowthe light emitting layer EL to emit light.

The charge control layer OL may be provided between the first electrodeE1 and the second electrode E2. The charge control layer OL may beadjacent to the light emitting layer EL. In the present embodiment, thecharge control layer OL may be provided between the light emitting layerEL and the second electrode E2, as illustrated in FIGS. 4A and 4B.However, the inventive concept is not limited to this example, and in anexemplary embodiment of the inventive concept, the charge control layerOL may be provided between the light emitting layer EL and the firstelectrode E1 or may include a plurality of layers, which are stacked inthe third direction DR3 with the light emitting layer EL interposedtherebetween.

The charge control layer OL may be formed without an additionalpatterning process, and thus, the charge control layer OL may be asingle pattern that is overlapped with the front surface of the basesubstrate 10. The charge control layer OL may be provided on otherregions, except for the openings formed in the fourth insulating layer31. The charge control layer OL may be used to control motion ofelectrons and thereby increase light-emitting efficiency of the displaypanel DP. The charge control layer OL may include an electron transportlayer and an electron injection layer.

The encapsulation layer TE may be provided on the organic light emittingdevice ED. The encapsulation layer TE may include inorganic or organiclayers. In the present embodiment, the encapsulation layer TE mayinclude a first inorganic layer 32, an organic layer 33, and a secondinorganic layer 34.

Each of the first and second inorganic layers 32 and 34 may be formed ofor include an inorganic material. For example, each of the first andsecond inorganic layers 32 and 34 may be formed of or include aluminumoxide, silicon oxide, silicon nitride, silicon oxynitride, siliconcarbide, titanium oxide, zirconium oxide, or zinc oxide. The first andsecond inorganic layers 32 and 34 may be equal to or different from eachother in terms of material.

The organic layer 33 may be provided between the first and secondinorganic layers 32 and 34. The organic layer 33 may be formed of orinclude an organic material. The organic layer 33 may be formed of orinclude, for example, epoxy, polyimide (PI), polyethylene terephthalate(PET), polycarbonate (PC), polyethylene (PE), or polyacrylate.

Each of the first and second inorganic layers 32 and 34 may be a singlepattern that is formed to substantially cover the front surface of thedisplay panel 100, when viewed in a plan view. Each of the first andsecond inorganic layers 32 and 34 may be partially overlapped with theorganic layer 33. For example, the first and second inorganic layers 32and 34 may be spaced apart from each other in the third direction DR3with the organic layer 33 interposed therebetween in a first region andmay be in direct contact with each other in the third direction DR3 in asecond region. The encapsulation layer TE may hermetically seal theorganic light emitting device ED and thereby protect the organic lightemitting device ED from an external contaminant.

In an exemplary embodiment of the inventive concept, the display panelDP may further include a dam portion DMP. The dam portion DMP may extendalong an edge region of the display region DA (e.g., see FIG. 2 ). Thedam portion DMP may enclose the display region DA or may be adjacent toat least a portion of the display region DA or adjacent to a pad ordriving circuit.

The dam portion DMP may include a first dam DM1 and a second dam DM2.The first dam DM1 may be formed of or include the same material as thethird insulating layer 23. The first dam DM1 may be formed using aprocess of forming the third insulating layer 23 and may be provided onthe same layer as the third insulating layer 23.

The second dam DM2 may be stacked on the first dam DM1. The second damDM2 may be formed of or include the same material as the fourthinsulating layer 31. The second dam DM2 may be formed using a process offorming the fourth insulating layer 31 and may be formed on the samelayer as the fourth insulating layer 31. However, the inventive conceptis not limited to these examples, and in an exemplary embodiment of theinventive concept, the dam portion DMP may have a single-layeredstructure.

In an exemplary embodiment of the inventive concept, a liquid organicmaterial may be supplied to form the organic layer 33, and during theformation of the organic layer 33, the dam portion DMP may be used todelimit a spreading boundary of the liquid organic material. In otherwords, the dam portion DMP may be used to limit how far the liquidorganic material spreads. The organic layer 33 may be formed by coatingthe first inorganic layer 32 with a liquid organic material using aninkjet method. In this case, the dam portion DMP may prevent the liquidorganic material from overflowing to an area outside of the dam portionDMP, thereby delimiting the spreading boundary of the liquid organicmaterial.

In an exemplary embodiment of the inventive concept, the display panelDP may further include a supplementary electrode pattern ELV. Thesupplementary electrode pattern ELV may be provided on the peripheralregion NDA and may be electrically coupled to the second electrode E2extended from the display region DA. The supplementary electrode patternELV may be used to stably supply a power voltage, which is provided fromthe outside of the display panel DP, to the second electrode E2.

In the present embodiment, the supplementary electrode pattern ELV maybe provided between the second insulating layer 22 and the thirdinsulating layer 23. The supplementary electrode pattern ELV may beprovided on the same layer as the input and output electrodes IE and OE.However, the inventive concept is not limited to this example, and in anexemplary embodiment of the inventive concept, a position of thesupplementary electrode pattern ELV may be variously changed.

The module hole MH may be provided in the hole region PA. The modulehole MH may penetrate the base substrate 10. For example, the modulehole MH may be formed by partially removing the base substrate 10, thefirst insulating layer 21, the charge control layer OL, the firstinorganic layer 32, and the second inorganic layer 34.

Since the module hole MH penetrates the display panel DP, some ofelements constituting the display panel DP may have ends defined by themodule hole MH. For example, as a result of the formation of the modulehole MH, the base substrate 10 may have ends 11E, 12E, 13E, and 14E, thefirst insulating layer 21 may have an end 21E, the charge control layerOL may have an end OLE, the first inorganic layer 32 may have an end32E, and the second inorganic layer may have an end 34E. In an exemplaryembodiment of the inventive concept, the ends 11E, 12E, 13E, 14E, 21E,OLE, 32E, and 34E may be aligned to each other to form an inner surfaceGE of the module hole MH.

The blocking groove BR may be provided in the hole region PA. Theblocking groove BR may be a recessed region, which is formed by removinga portion of the base substrate 10. In an exemplary embodiment of theinventive concept, the first inorganic layer 32 may cover the recessedregion and thereby define an inner surface of the blocking groove BR.

The filling member FM may be provided on the inner surface of theblocking groove BR. The filling member FM may include a liquid organicmaterial and may fill the blocking groove BR. In an exemplary embodimentof the inventive concept, the blocking groove BR may be formed of orinclude the same material as the organic layer 33.

In the display panel DP according to an exemplary embodiment of theinventive concept, the touch sensing unit TSU may be directly formed onthe encapsulation layer TE, as shown in FIG. 4B. The touch sensing unitTSU may include a touch sensing part provided on the display region DAand touch signal lines provided on the peripheral region NDA. In anexemplary embodiment of the inventive concept, the touch sensing partmay not be overlapped with the organic light emitting device ED, whenviewed in a plan view.

The signal touch signal lines may be coupled to the touch sensing part.

In an exemplary embodiment of the inventive concept, the touch sensingunit TSU may have a multi- or single-layered structure. In an exemplaryembodiment of the inventive concept, the touch sensing unit TSU may beconfigured to sense an external input in a mutual-capacitance mannerand/or a self-capacitance manner. A third inorganic layer 36 may coverthe touch sensing unit TSU. The third inorganic layer 36 may cover thesecond inorganic layer 34.

FIGS. 5A and 5B are sectional views each illustrating a hole region ofFIG. 4A. For convenience in illustration, each of FIGS. 5A and 5Billustrates an enlarged shape of the blocking groove BR. To reducecomplexity in the drawings, some (e.g., the filling member FM, the firstinorganic layer 32, and the second inorganic layer 34) of elementsconstituting the blocking groove BR of FIG. 4A are omitted from FIG. 5A.

Referring to FIG. 5A, the blocking groove BR may have an internal spaceNG, which is recessed from the front surface of the base substrate 10.The internal space NG may include a patterned portion PB and an openingPO.

The patterned portion PB may be an empty space, which is formed byrecessing the top surface of the first base layer 12. In an exemplaryembodiment of the inventive concept, the patterned portion PB may beprovided in the form of a through hole. For example, the patternedportion PB may penetrate the first base layer 12 and expose a portion ofthe second barrier layer 13.

The opening PO may be an empty space, which is formed by removing aportion of the first barrier layer 11. The opening PO may be overlappedwith the patterned portion PB, when viewed in a plan view. The openingPO, along with the patterned portion PB, may define the internal spaceNG.

Inner side surfaces of the patterned portion PB may be spaced apart fromeach other by a distance of a first width W1, in the second directionDR2. The opening PO may have a second width W2 in the second directionDR2. In an exemplary embodiment of the inventive concept, the firstwidth W1 may be larger than the second width W2.

A portion of the first barrier layer 11 located between the blockinggroove BR and the module hole MH may include one end 11E adjacent to themodule hole MH and an opposite end adjacent to the blocking groove BR.The opposite end of the first barrier layer 11 may define a part of aside surface of the opening PO. The opposite end of the first barrierlayer 11 may be positioned in such a way that a distance between theopposite end and the module hole ME is larger than a distance from aninner side surface PB-S of the blocking groove BR and the module holeMH. For example, the opposite end of the first barrier layer 11 may havea shape protruding from a portion of an inner side surface PB-S of theblocking groove BR adjacent to the module hole MH. Thus, when viewed ina plan view, the opposite end of the first barrier layer 11 defining theopening PO may cover a portion of the patterned portion PB.

The one end 11E of the first barrier layer 11 may define a portion ofthe module hole MH. For example, the one end 11E of the first barrierlayer 11 may be aligned to the end 21E of the first insulating layer 21.

Although an embodiment of the inventive concept has been described withreference to the first barrier layer 11 with the two opposite ends, eachof other layers (e.g., the first insulating layer 21 and the chargecontrol layer OL), which are provided between the blocking groove BR andthe module hole HM, may also be provided to have the same or similarstructure as that of the first barrier layer 11.

As shown in FIG. 5A, an additional pattern OL-P may be further providedin the internal space NG of the blocking groove BR. In an exemplaryembodiment of the inventive concept, the additional pattern OL-P may beprovided on an exposed surface 13-T of the second barrier layer 13exposed by the patterned portion PB. A portion of the additional patternOL-P may be overlapped with an opening, when viewed in a plan view. Theadditional pattern OL-P may be formed of or include the same material asat least one of the elements constituting the organic light emittingdevice ED.

A tip portion TP protruding from the inner side surface PB-S of thepatterned portion PB may be formed. For example, the tip portion TP maybe composed of protruding portions of the first barrier layer 11, thefirst insulating layer 21, and the charge control layer OL. In anexemplary embodiment of the inventive concept, the tip portion TP may bedefined by an under-cut region of the first base layer 12.

In FIG. 5B, the filling member FM, the first inorganic layer 32, and thesecond inorganic layer 34 are further illustrated, in addition to theelements of FIG. 5A.

The first inorganic layer 32 may cover the internal space NG of theblocking groove BR. For example, the first inorganic layer 32 may coverthe inner side surface PB-S of the patterned portion PB, the exposedsurface 13-T, the additional pattern OL-P, and the tip portion TP,thereby defining an inner surface of the blocking groove BR.

The filling member FM may fill the blocking groove BR provided with thefirst inorganic layer 32. The filling member FM may be in contact withthe first inorganic layer 32 covering the internal space NG. The secondinorganic layer 34 may cover a top surface FM-U of the filling member FMand a top surface 32-U of the first inorganic layer 32 adjacent thereto.For example, the second inorganic layer 34 may be in direct contact witha portion of the first inorganic layer 32 adjacent to the blockinggroove BR. The filling member FM may be formed of or include the samematerial as the organic layer 33 of the encapsulation layer TE.

Since the module hole MH penetrates the display panel DP, some of theelements constituting the display panel DP may have ends defined by themodule hole MH. For example, as a result of the formation of the modulehole MH, the base substrate 10 may have ends 11E, 12E, 13E, and 14E, thefirst insulating layer 21 may have an end 21E, the charge control layerOL may have an end OLE, the first inorganic layer 32 may have an end32E, and the second inorganic layer may have an end 34E. In an exemplaryembodiment of the inventive concept, the ends 11E, 12E, 13E, 14E, 21E,OLE, 32E, and 34E may be aligned to each other to define the innersurface GE of the module hole MH.

In an exemplary embodiment of the inventive concept, the filling memberFM may be provided in the blocking groove BR to support the tip portionTP. Since the tip portion TP is supported by the filling member FM, thedisplay panel DP may have an increased impact-resistant property. Inaddition, since a portion of the inner surface GE of the module hole MHexposed to the outside is defined by the first and second inorganiclayers 32 and 34, which are in contact with each other, and the portionof the inner surface GE of the module hole MH is spaced apart from thefilling member FM, it is possible to block a contamination material(e.g., moisture and/or oxygen) supplied from the outside. In otherwords, it is possible to increase reliability of the display panel DP.

FIGS. 6A to 6E are sectional views each illustrating a portion of adisplay panel according to an exemplary embodiment of the inventiveconcept. Hereinafter, an element previously described with reference toFIGS. 1 to 5B may be identified by the same reference number withoutrepeating an overlapping description thereof.

In an embodiment of FIG. 6A, a base substrate 10-A may have asingle-layered structure. For example, the base substrate 10-A may beconfigured to have only a barrier layer 11-A and a base layer 12-A. Inan exemplary embodiment of the inventive concept, the base layer 12-Amay be partially removed to form a patterned portion PB-A as an emptyspace. The patterned portion PB-A may include an inner side surfacePB-SA and a bottom surface PB-TA. A first inorganic layer 32-A may coveran inner space NG-A of a blocking groove BR-A. In this case, theblocking groove BR-A may not penetrate the first base layer 12-A and maybe provided in the first base layer 12-A. Furthermore, an additionalpattern OL-PA may be provided on the bottom surface PB-TA. In FIG. 6A,FM-A refers to a filling member, and OL-A refers to a charge controllayer, for example. In the rest of FIGS. 6B to 6E, the aforementionedreference numerals may be additionally denoted with a “B, C, D, or Z”depending on which figure they are illustrated in. For example, in FIG.6B, FM-B may refer to a filling member.

Referring to FIG. 6B, a blocking groove PB-B may include a plurality ofpatterned portions PB-B1 and PB-B2 and a plurality of openings PO-B1 andPO-B2, unlike the blocking groove PB-A of FIG. 6A. In an exemplaryembodiment of the inventive concept, the blocking groove PB-B mayinclude a first opening PO-B1, a second opening PO-B2, a first patternedportion PB-B1, and a second patterned portion PB-B2.

The first opening PO-B1 may be formed by removing a portion of a firstbarrier layer 11-B. The first patterned portion PB-B1 may penetrate afirst base layer 12-B. The first patterned portion PB-B1 may include aninner side surface.

The second the opening PO-B2 may be formed by removing a portion of asecond barrier layer 13-B. The second opening PO-B2 may be overlappedwith the first opening PO-B1, when viewed in a plan view. The secondpatterned portion PB-B2 may be formed by recessing a portion of a secondbase layer 14-B. The second patterned portion PB-B2 may include an innerside surface PB-S2B and a bottom surface PB-T2B.

Thus, an internal space NG-B of a blocking groove BR-B may be defined bythe first opening PO-B1, the first patterned portion PB-B1, an exposedsurface 13-TB of the second barrier layer 13-B, the second openingPO-B2, and the second patterned portion PB-B2. The exposed surface 13-TBof the second barrier layer 13-B is exposed by the first patternedportion PB-B1.

In the present embodiment, a first width W3 in the second direction DR2of the first opening PO-B1 may be larger than a second width W4 in thesecond direction DR2 of the second opening PO-B2.

A filling member FM-B may fill at least a portion of the blocking grooveBR-B covered with a first inorganic layer 32-B. The filling member FM-Bmay be used to support a portion of the first barrier layer 11-Bprotruding from an inner side surface of the first base layer 12-B and aportion of the second barrier layer 13-B protruding from an inner sidesurface of the second base layer 14-B. Furthermore, an additionalpattern OL-PB may be provided on the bottom surface PB-T2B.

Referring to FIG. 6C, unlike the blocking groove PB-B of FIG. 6B, apatterned portion PB-C may be provided to have a varying width in thethird direction DR3. The patterned portion PB-C may include an innerside surface.

A first inorganic layer 32-C may cover the patterned portion PB-C, and afilling member FM-C may be provided in a blocking groove BR-C. The firstinorganic layer 32-C and the filling member FM-C may have shapescorresponding to a shape of the inner side surface of the patternedportion PB-C. FIG. 6C illustrates an example in which the patternedportion PB-C is provided on a second barrier layer 13-C, but theinventive concept is not limited thereto. For example, in each of theblocking grooves shown in FIGS. 6A and 6B, the patterned portion PB-Cmay be provided to have a varying width. Furthermore, an additionalpattern OL-PC may be provided on the second barrier layer 13-C.

In an exemplary embodiment of the inventive concept, as shown in FIG.6D, an organic pattern may be omitted from an electronic device. Thus,the first inorganic layer 32-D may cover a front surface of the exposedsurface 13-TD. FIG. 6D illustrates an example in which a patternedportion PB-D is provided on a second barrier layer 13-D, but theinventive concept is not limited thereto. For example, the organicpattern may be omitted in each of the blocking grooves shown in FIGS. 6Ato 6C.

Referring to FIG. 6E, unlike the structure shown in FIG. 5B, the secondinsulating layer 21 or 21E (e.g., see FIG. 5B) may be omitted on a firstinsulating layer 11-Z adjacent to an opening PO-Z. For example, a chargecontrol layer OL-Z may be directly provided on the first insulatinglayer 11-Z adjacent to the opening PO-Z. The structure of FIG. 6E, fromwhich the second insulating layer is omitted, may be applied to thestructures of FIGS. 6A to 6D. In other words, the second insulatinglayer may be omitted from a region adjacent to the blocking groove BR-A,BR-B, BR-C and BR-D shown in FIGS. 6A to 6D. Furthermore, an additionalpattern OL-PZ may be provided on a second barrier layer 13-Z.

In the present embodiment, since the second insulating layer 21 or 21Eis omitted from a region adjacent to a blocking groove BR-Z, it ispossible to reduce a thickness of the tip portion TP (e.g., see FIG. 5B)covered with a first inorganic layer 32-Z. This may allow the tipportion TP, which is supported by the first inorganic layer 32-Z, tohave an increased impact-resistant strength. As a result, the blockinggroove BR-Z may have a robust structure.

FIG. 7 is a sectional view illustrating a portion of a display panelaccording to an exemplary embodiment of the inventive concept. Forconcise description, an element previously described with reference toFIGS. 4A to 5B may be identified by the same reference number withoutrepeating an overlapping description thereof. The display panel of FIG.7 may be configured to have substantially the same features as one ofthe structures described with reference to FIGS. 6A to 6B.

In an exemplary embodiment, a display panel DP-1 may include a pluralityof blocking grooves BR1 and BR2. The blocking grooves BR1 and BR2 may bespaced apart from each other, in the hole region PA. Each of theblocking grooves BR1 and BR2 may enclose the module hole MH.

As shown in FIG. 7 , the plurality of blocking grooves BR1 and BR2 mayinclude a first blocking groove BR1 and a second blocking groove BR2.The first blocking groove BR1 may be closer to the module hole MH thanthe second blocking groove BR2. As shown in FIG. 7 , the first andsecond blocking grooves BR1 and BR2 may have substantially the samesectional shape. However, the inventive concept is not limited to thisexample, and in an exemplary embodiment of the inventive concept, theblocking grooves may have different shapes.

The first inorganic layer 32 may enclose an internal space of each ofthe first and second blocking grooves BR1 and BR2, thereby defining aninner surface of each of the first and second blocking grooves BR1 andBR2. A first filling member FM1 may be provided on the inner surface ofthe first blocking groove BR1, and a second filling member FM2 may beprovided on the inner surface of the second blocking groove BR2. Forexample, the first and second filling members FM1 and FM2 may fill atleast a portion of the internal space of a corresponding one of thefirst and second blocking grooves BR1 and BR2.

In the present embodiment, the first filling member FM1, the secondfilling member FM2, and the first inorganic layer 32 adjacent to thefirst and second filling members FM1 and FM2 may be covered with thesecond inorganic layer 34. For example, the second inorganic layer 34may be in contact with a top surface FM1-U of the first filling memberFM1 and a top surface FM2-U of the second filling member FM2. In FIG. 7, OL-P1 and OL-P2 may refer to first and second additional patterns.

According to the above embodiments of the inventive concept, a pluralityof blocking grooves may be provided, and this makes it possible to moreeffectively prevent moisture and/or oxygen from entering the displaypanel DP-1. Accordingly, it is be possible to realize the display panelDP-1 with increased reliability.

FIGS. 8A to 8C are plan views each illustrating a hole region accordingto an exemplary embodiment of the inventive concept. For convenience inillustration, in FIGS. 8A to 8C, some elements, which are provided inregions corresponding to hole regions PA1, PA2, and PA3, are illustratedwith hatched patterns. In addition, the first inorganic layer 32 and thesecond inorganic layer 34, which are provided in the hole region PA ofFIG. 4A, are omitted from FIGS. 8A to 8C. Hereinafter, the structures ofhole regions according to exemplary embodiments of the inventive conceptwill be described with reference to FIGS. 8A to 8C.

As shown in FIG. 8A, the hole region PA1 may include a module hole MH-S1and blocking grooves BR1-S1 and BR2-S1. The module hole MH-S1 may have apolygonal shape, when viewed in a plan view. For example, the modulehole MH-S1 may have a rectangular shape, as shown in FIG. 8A. Inexemplary embodiments of the inventive concept, the module hole MH-S1may have a polygonal pillar shape. The first blocking groove BR1-S1 andthe second blocking groove BR2-S1 may be spaced apart from each other.

The first and second blocking grooves BR1-S1 and BR2-S1 may be formedalong an edge of the module hole MH-S1. In an exemplary embodiment ofthe inventive concept, at least one of the first and second blockinggrooves BR1-S1 and BR2-S1 may have a shape corresponding to the modulehole MH-S1. For example, each of the first and second blocking groovesBR1-S1 and BR2-S1 may be shaped like a rectangular closed line enclosingthe module hole MH-S1, when viewed in a plan view.

As shown in FIG. 8B, the hole region PA2 may include a module hole MN-S2and blocking grooves BR1-S2 and BR2-S2, which have different shapes fromeach other. For example, when viewed in a plan view, the module holeMH-S2 may be provided to have a circular shape, and the blocking groovesBR1-S2 and BR2-S2 may have a planar shape different from the module holeMH-S2. As shown in FIG. 8B, each of the blocking grooves BR1-S2 andBR2-S2 may be shaped like a rectangular closed line, but the inventiveconcept is not limited to this example. For example, in an exemplaryembodiment of the inventive concept, the shape of at least one of theblocking grooves BR1-S2 and BR2-S2 may be variously changed, independentof the shape of the module hole MH-S2, if such a blocking groove islocated adjacent to the module hole MH-S2.

As shown in FIG. 8C, the hole region PA3 may include a module hole MH-S3and blocking grooves BR1-S3 and BR2-S3, which have different shapes fromeach other. For example, when viewed in a plan view, the module holeMH-S3 may have a circular shape, and each of the blocking grooves BR1-S3and BR2-S3 may be shaped like an octagonal closed line.

The smaller a difference in planar shapes between the blocking groovesBR1-S3 and BR2-S3 and the module hole MH-S3, the smaller an area of aregion between the blocking grooves BR1-S3 and BR2-S3 and the modulehole MH-S3. In other words, in the case where the difference in planarshapes between the blocking grooves BR1-S3 and BR2-S3 and the modulehole MH-S3 is small, it is possible to reduce an area of the hole regionPA3 provided in the display region DA (e.g., see FIG. 2 ) and therebyreduce an influence of the hole region PA3 on the display region DA.

FIGS. 9A to 9C are sectional views each illustrating a display panelaccording to an exemplary embodiment of the inventive concept. Forconcise description, an element previously described with reference toFIGS. 4A to 5B may be identified by the same reference number withoutrepeating an overlapping description thereof. In FIGS. 9A to 9C, thereference numerals may be denoted with an “E, F, or G” depending onwhich figure they are illustrated in. For example, in FIG. 9B, DMP-F mayrefer to a partition wall member.

As shown in FIG. 9A, a display panel DP-E may further include apartition wall member DMP-E. The partition wall member DMP-E may beadjacent to an organic layer 33-E and may be used to prevent anoccupying area of the organic layer 33-E from being increased, whenviewed in a plan view. For example, the partition wall member DMP-E maybe used to control a position of the organic layer 33-E.

In an exemplary embodiment of the inventive concept, the partition wallmember DMP-E may be disposed between the organic layer 33-E and ablocking groove BR-E, when viewed in a plan view. The partition wallmember DMP-E may extend along an edge of the hole region PA. Thepartition wall member DMP-E may be covered with a charge control layerOL-E, a first inorganic layer 32-E, and a second inorganic layer 34-E.

The partition wall member DMP-E may include a first member DM1-E, asecond member DM2-E, and a third member DM3-E. The first member DM1-E,the second member DM2-E, and the third member DM3-E may be sequentiallystacked.

The first member DM1-E may be formed of or include the same material asa second insulating layer 22-E. The second member DM2-E may be formed ofor include the same material as a third insulating layer 23-E. The thirdmember DM3-E may be formed of or include the same material as a fourthinsulating layer 31-E. In an exemplary embodiment of the inventiveconcept, each of the first member DM1-E, the second member DM2-E, andthe third member DM3-E may be formed by the same process as that forforming a corresponding insulating layer, in which the same material isincluded.

In an exemplary embodiment of the inventive concept, the partition wallmember DMP-E is provided on a first insulating layer 21-E, but theinventive concept is not limited thereto. For example, in the case wherethe partition wall member DMP-E is provided on the second insulatinglayer 22-E, the first member DM1-E is omitted from the partition wallmember DMP-E. Alternatively, in the case where the partition wall memberDMP-E is provided on the third insulating layer 23-E, the first memberDM1-E and the second member DM2-E may be omitted. Furthermore, thepartition wall member DMP-E may have a single-layered structure or adouble-layered structure, from which one of the first to third membersDM1-E to DM3-E is omitted, and the inventive concept is not limited to aspecific one of these embodiments.

The organic layer 33-E covering at least a portion of a display devicelayer 30-E may be formed by an inkjet process of forming a liquidorganic material on a first inorganic layer 32-E. In this case, thepartition wall member DMP-E may be used to delimit a boundary of aregion for the liquid organic material and to prevent the liquid organicmaterial from being overflown into an outer region beyond the partitionwall member DMP-E.

As shown in FIG. 9B, a display panel DP-F may include a plurality ofblocking grooves BR1-F and BR2-F. In an exemplary embodiment of theinventive concept, a partition wall member DMP-F may be provided betweenthe plurality of the blocking grooves BR1-F and BR2-F.

In the present embodiment, the partition wall member DMP-F may bedisposed on a portion 21-PF of a first insulating layer 21-F disposedbetween the blocking grooves BR1-F and BR2-F.

An organic layer 33-F may partially cover a thin-film device layer 20-Fand a display device layer 30-F. In an exemplary embodiment of theinventive concept, the formation of the organic layer 33-F may includeforming a liquid organic material on a base substrate 10-F using aninkjet process. In this case, the organic layer 33-F may also fill thefirst blocking groove BR1-F. Thus, the first blocking groove BR1-F maybe filled with the organic layer 33-F, which covers the thin-film devicelayer 20-F and the display device layer 30-F, without an additionalfilling process. Accordingly, it is possible to reduce an overallprocess time, and moreover, since the first blocking groove BR1-F isfilled with the organic layer 33-F, it is possible to realize a displaypanel with an increased impact-resistant strength.

A filling member FM-F including the same material as the organic layer33-F may be provided in the second blocking groove BR2-F. A top surfaceFM-UF of the filling member FM-F may be covered with a second inorganiclayer 34-F covering the organic layer 33-F.

As shown in FIG. 9C, a partition wall member DMP-G may be providedbetween a module hole MH-G and a first blocking groove BR1-G. In anexemplary embodiment of the inventive concept, the partition wall memberDMP-G may be provided on a portion 21-PG of a first insulating layer21-G, which is located between the module hole MH-G and the firstblocking groove BR1-G. In an exemplary embodiment of the inventiveconcept, when an organic layer 33-G in a liquid state is formed using aninkjet process, the organic layer 33-G may be formed to partially covera thin-film device layer 20-G and a display device layer 30-G and fillan internal space of each of a first blocking groove BR1-G and a secondblocking groove BR2-G. In other words, since the organic layer 33-Gfilling the first and second blocking grooves BR1-G and BR2-G andcovering the thin-film device layer 20-G and the display device layer30-G is formed through a single process, it is possible to reduce anoverall process time. In addition, since the first and second blockinggrooves BR1-G and BR2-G are filled with the organic layer 33-G, it ispossible to realize a display panel with an increased impact-resistantstrength.

FIGS. 10A to 10G are sectional views illustrating a method offabricating a display panel, according to an exemplary embodiment of theinventive concept. For concise description, an element previouslydescribed with reference to FIGS. 4A to 5B may be identified by the samereference number without repeating an overlapping description thereof.Hereinafter, a method of fabricating a display panel will be describedwith reference to FIGS. 10A to 10G.

As shown in FIG. 10A, a first preliminary substrate DPA with at leastone blocking groove may be provided. The first preliminary substrate DPAmay include the base substrate 10, the thin-film device layer 20, andthe fourth insulating layer 31. The first preliminary substrate DPA mayhave substantially the same structure as the display panel DP of FIG.4A; however, in FIG. 10A the charge control layer OL and other layersformed on the display panel DP are omitted. In other words, the firstpreliminary substrate DPA may include the first electrode E1 and thelight emitting layer EL, which are formed on the display region DA asshown in FIG. 4A.

The blocking groove BR having an under-cut shape may be provided in thefirst preliminary substrate DPA. The blocking groove BR may be formed byan etching process or a laser process. In the case where the etchingprocess is used, a difference in etch rate between the first barrierlayer 11 and the first base layer 12 may be used to form the blockinggroove BR with the under-cut shape. In the case where the laser processis used, a variation in reactivity caused by a wavelength of a laserlight may be used to form the blocking groove BR with the under-cutshape. However, the inventive concept is not limited to this example.For example, any etching method of selectively removing an inorganicmaterial and/or organic material may be used to form the blocking grooveBR with the under-cut shape.

Thereafter, as shown in FIG. 10B, a second preliminary substrate DPB maybe formed by forming the charge control layer OL constituting theorganic light emitting device ED of FIG. 4A. The charge control layer OLmay be formed by depositing an organic material. As shown in FIG. 10B,the charge control layer OL may be deposited on a portion of the exposedsurface 13-T exposed through the opening PO. Thus, the additionalpattern OL-P may be formed on a portion of a bottom surface of thepatterned portion PB. The additional pattern OL-P of FIG. 10B may beformed by the same deposition process as that for the charge controllayer OL, but the inventive concept is not limited thereto. For example,the additional pattern OL-P may be formed of or include the samematerial as at least one of the elements constituting the organic lightemitting device ED.

The deposition of the organic material may be performed in ananisotropic manner. Hence, a portion of the organic material may belocally deposited on a specific region of the patterned portion PBexposed through the opening PO, thereby forming a localized pattern. Inother words, the localized pattern may be spaced apart from the chargecontrol layer OL. However, the inventive concept is not limited to thisexample, and in an exemplary embodiment of the inventive concept, thelocalized pattern may not be formed, depending on process conditions(e.g., time or deposition rate) for the deposition process.

Next, as shown in FIG. 10C, the first inorganic layer 32 may be formed.In an exemplary embodiment of the inventive concept, a chemical vapordeposition may be used to form the first inorganic layer 32 on theentire top surface of the base substrate 10. The deposition of the firstinorganic layer 32 may be performed in an isotropic manner. For example,the first inorganic layer 32 may be formed to conformally cover theinner surface of the internal space NG. Thus, an exposed surface of thefirst inorganic layer 32 may be used as an inner surface of the blockinggroove BR. The first inorganic layer 32 may be formed to be in contactwith the undercut regions of the blocking groove BR.

Thereafter, as shown in FIG. 10D, a preliminary organic layer 331 may beformed by providing an organic material to cover the front surface ofthe first inorganic layer 32. The preliminary organic layer 331 may beformed by an inkjet process. For example, a liquid organic material maybe provided to form the preliminary organic layer 331. The liquidorganic material may be provided on a region of the display region DA,which is spaced apart from the hole region PA, and in this case, sincethe organic material is in a highly viscous liquid state, the organicmaterial may fill the blocking groove BR.

Next, as shown in FIG. 10E, a portion of the preliminary organic layer331 may be removed to form the organic layer 33 and the filling memberFM. The partial removal of the preliminary organic layer 331 may beperformed using an ashing process. For example, a plasma ashing processmay be used to remove the portion of the preliminary organic layer 33I.In FIG. 10E, the ashing process may be shown as “AS.” In an exemplaryembodiment of the inventive concept, the ashing process may be performedto remove other portions of the preliminary organic layer 33I, exceptfor the organic layer 33 and the filling member FM. For example, otherportions of the preliminary organic layer 33I, except for a portionfilling the blocking groove BR, may be removed from the hole region PA.Thus, the preliminary organic layer 33I may not remain on a portion ofthe first inorganic layer 32 which is adjacent to the blocking groove BRof the hole region PA. After the ashing process, the remaining portionof the preliminary organic layer 33I on the display region DA may beused as the organic layer 33 constituting the encapsulation layer TE

Thereafter, as shown in FIG. 10F, the second inorganic layer 34including an inorganic material may be deposited on the base substrate10. The second inorganic layer 34 may be formed on the front surface ofthe base substrate 10 by a chemical vapor deposition. For example, thesecond inorganic layer 34 may be formed on the front surface of the basesubstrate to cover the organic layer 33 and the filling member FM. Thesecond inorganic layer 34 may be in contact with the top surface FM-U ofthe patterned portion PB. In addition, since, as described above, aportion of the preliminary organic layer 33I adjacent to the blockinggroove BR is removed by the ashing process, the second inorganic layer34 may be formed to be in contact with a top surface 32-U of the firstinorganic layer 32 adjacent to the blocking groove BR. Accordingly, itis possible to prevent a moisture entering path from being formed in aregion adjacent to the blocking groove BR. As shown in FIG. 10G, themodule hole MH may be formed in a region the hole region PA. The modulehole MH may be formed by the same process as that for one of theelements constituting the pixel layer PL (e.g., see FIG. 4A). Referringback to FIG. 5B, the module hole MH may have the inner surface GEdefined by the ends 11E, 12E, 13E, and 14E of the base substrate 10, theend 21E of the first insulating layer 21, the end OLE of the chargecontrol layer OL, the end 32E of the first inorganic layer 32, and theend 34E of the second inorganic layer 34, which are aligned to eachother.

In a method of fabricating a display panel according to an exemplaryembodiment of the inventive concept, the filling member FM supportingthe blocking groove BR and the organic layer 33 constituting theencapsulation layer TE may be simultaneously formed by the same process,and thus, it is possible to increase process efficiency in a fabricationprocess. Furthermore, since the filling member FM is formed to fill orsupport a relatively weak under-cut shaped portion (e.g., the blockinggroove BR), it is possible to realize a display panel with an increasedimpact-resistant strength. In addition, the first and second inorganiclayers 32 and 34 adjacent to the module hole MH may be formed to be incontact with each other; thus, it is possible to more efficiently blocka contamination material (e.g., moisture and/or oxygen), which may enterfrom the outside.

FIGS. 11A to 11E are sectional views illustrating a method offabricating a display panel including a partition wall member, accordingto an exemplary embodiment of the inventive concept. For concisedescription, an element previously described with reference to FIGS. 10Ato 10G may be identified by the same reference number without repeatingan overlapping description thereof. Hereinafter, a method of fabricatinga display panel including the partition wall member will be describedwith reference to FIGS. 11A to 11E. In FIGS. 11A to 11E, the referencenumerals may be denoted with an “E”. For example, in FIG. 11B, DMP-E mayrefer to a partition wall member.

As shown in FIG. 11A, a partition wall member DMP-E may be formed on abase substrate 10-E. The partition wall member DMP-E may be amulti-layered structure including the same materials as at least one ofinsulating layers constituting a pixel layer. In FIG. 11A, the partitionwall member DMP-E is illustrated to include the first, second, and thirdmembers DM1-E, DM2-E, and DM3-E, which include the same materials as thesecond, third, and fourth insulating layers 22-E, 23-E, and 31-E,respectively, and are sequentially stacked, but the inventive concept isnot limited thereto. For example, at least one of the first, second, andthird members DM1-E, DM2-E, and DM3-E may be omitted, and moreover, thepartition wall member DMP-E may be formed to have a single-layeredstructure.

The partition wall member DMP-E may be formed between the second, thirdand fourth insulating layers 22-E, 23-E, and 31-E and the blockinggroove BR-E. FIG. 11A illustrates an example in which the partition wallmember DMP-E is provided on the first insulating layer 21-E, but theinventive concept is not limited thereto. For example, the partitionwall member DMP-E may be directly provided on another insulating layer,except for the first insulating layer 21-E, or on the base substrate10-E.

Thereafter, as shown in FIG. 11B, the charge control layer OL-E may bedeposited on the base substrate 10-E. The charge control layer OL-E maybe deposited to cover the partition wall member DMP-E. Next, the firstinorganic layer 32-E may be deposited on a front surface of the chargecontrol layer OL-E. In an exemplary embodiment of the inventive concept,the charge control layer OL-E and the first inorganic layer 32-E may bedeposited using substantially the same methods as those described withreference to FIGS. 10B and 10C.

Next, as shown in FIG. 11C, the organic layer 33-E may be formed on thedisplay region DA. The organic layer 33-E may be formed by a printingprocess (e.g., an inkjet process) or by a deposition process. Theorganic layer 33-E may be supplied in the form of a liquid material, andin this case, the partition wall member DMP-E may prevent the organiclayer 33-E from being overflown toward the blocking groove BR-E.

Thereafter, a preliminary filling member FM1 including an organicmaterial may be provided on the blocking groove BR-E or a regionadjacent to the blocking groove BR-E. The preliminary filling member FM1may be formed on a region of the first inorganic layer 32-E, which islocated adjacent to the blocking groove BR-E, with the partition wallmember DMP-E interposed therebetween. The preliminary filling member FM1may be formed by a printing process (e.g., an inkjet process) or adeposition process.

Next, as shown in FIG. 11D, a portion of the preliminary filling memberFM1 may be removed to form a filling member FM-E filling the blockinggroove BR-E. As a result of the partial removal of the preliminaryfilling member FM1, a top surface FM-UE of the filling member FM-E and atop surface 32-UE of the first inorganic layer 32-E adjacent to the topsurface FM-UE may be exposed to the outside.

Thereafter, as shown in FIG. 11E, a second inorganic layer 34-Eincluding an inorganic material may be deposited on the base substrate10-E. The second inorganic layer 34-E may be deposited to cover theorganic layer 33-E, the exposed top surface FM-UE of the filling memberFM-E, and the exposed top surface 32-UE of the first inorganic layer32-E adjacent to the top surface FM-UE.

In a method of fabricating a display panel according to an exemplaryembodiment of the inventive concept, unlike the method described withreference to FIGS. 10D and 10G, the partition wall member DMP-E may beused to delimit a boundary of a region, on which a liquid organicmaterial for the organic layer 33-E will be provided, when the organiclayer 33-E is deposited on the display region DA. Thus, the organiclayer 33-E constituting the encapsulation layer TE (e.g., see FIG. 4A)may be formed by a single process, and it is possible to omit anadditional ashing process.

According to an exemplary embodiment of the inventive concept, anelectronic module and a display panel are provided to have nointerference therebetween. Thus, even when an electronic module isprovided in a display device, it is possible to realize a display devicewith a narrow bezel region. In addition, it is possible to prevent adevice from being damaged by a contamination material (e.g., moistureand/or oxygen) supplied from the outside. Accordingly, a display devicewith increased process and operational reliability may be provided.

In addition, according to an exemplary embodiment of the inventiveconcept, a filling member is provided in a blocking groove, and thismakes it possible to realize a highly reliable display device.

While the inventive concept has been particularly shown and describedwith reference to exemplary embodiments thereof, it will be understoodby one of ordinary skill in the art that variations in form and detailmay be made thereto without departing from the spirit and scope of theinventive concept as defined by the attached claims.

What is claimed is:
 1. A display panel, comprising: a display region, ahole region at least partially surrounded by the display region, and anintermediate region disposed between the display region and the holeregion and the display panel comprising: a module hole in the holeregion and passing through the display panel; a first groove in theintermediate region and surrounding the module hole; a second groove inthe intermediate region and disposed between the first groove and modulehole; a light emitting element in the display region; an encapsulationlayer including a first inorganic layer covering the light emittingelement, a second inorganic layer, and an organic layer disposed betweenthe first inorganic layer and the second inorganic layer; a dam portionin the intermediate region and surrounding the module hole; and anorganic pattern disposed in the first groove and the second groove, andwherein a portion of the organic layer is disposed in the first groove.2. The display panel of claim 1, wherein the first inorganic layer isdisposed in the first groove to cover the portion of the organic layer.3. The display panel of claim 1, further comprising a filling memberdisposed in the second groove.
 4. The display panel of claim 3, whereinthe filling member has a same material as the organic layer.
 5. Thedisplay panel of claim 1, further comprising a plurality of insulatinglayers disposed on the display region, and wherein the dam portion has asame material as at least one of the plurality of insulating layers. 6.The display panel of claim 1, wherein the light emitting element furthercomprises a first electrode, a second electrode, a light emitting layer,and a charge control layer disposed between the first electrode and thesecond electrode, and wherein the organic pattern has a same material asthe charge control layer or the light emitting layer.
 7. The displaypanel of claim 1, wherein the first inorganic layer covers the organicpattern in the first groove and the second groove.
 8. The display panelof claim 1, wherein the display panel comprises a base layer including afirst organic material and a barrier layer disposed on the base layerand including a first inorganic material, and each of the first grooveand the second groove comprises a base groove in which a portion of thebase layer is recessed, and a substrate opening penetrating the barrierlayer and overlapping the base groove.
 9. The display panel of claim 8,wherein the display panel further comprises at least one insulatinglayer including an inorganic material and disposed on the barrier layer,and wherein the insulating layer comprises a insulating grooveoverlapping the substrate opening.
 10. The display panel of claim 9,further comprising a transistor comprising a semiconductor layer andconnecting the light emitting element, and wherein the insulation layercovers the semiconductor layer.
 11. The display panel of claim 8,wherein the display panel comprises a sub base layer including a secondorganic material disposed under the base layer and a sub barrier layerdisposed between the base layer and sub base layer and including asecond inorganic material, and wherein the base groove exposes the subbarrier layer.
 12. The display panel of claim 1, wherein at least one ofthe first groove and the second groove has a circular, an oval, or apolygonal closed line shape on a plane3
 13. The display panel of claim12, wherein the module hole has a circular, an oval, or a polygonalshape on a plane.
 14. The display panel of claim 1, wherein the damportion is disposed between the first groove and the second groove. 15.The display panel of claim 11, wherein the dam portion is disposedbetween the second groove and the module hole.